Intel Core i3 2332M 

Released September, 2011
  • 2.2 GHz
  • Dual core

So some of the key aspects of the Broadwell microarchitecture would be to be suitable for fanless devices, deliver on core performance improvements and feature enhanced graphics, media, display capabilities.
by hassan-mujtaba (Sep, 2014)
The graphics architecture of Broadwell-Y will ship with up to 24 EUs (execution units) which is 20% higher than the 20 EUs in Haswell.
by Ryan-Shrout (Aug, 2014)

Benchmarks Real world tests of the Intel Core i3 2332M

PassMark Data courtesy Passmark

Core i3 2332M
2,382
A6 4400M
1,624

PassMark (Single Core)

Core i3 2332M
1,039
A6 4400M
995

In The News From around the web

9
Apr

Intel’s erratic Core M performance leaves an opening for AMD

by Joel Hruska |
www.extremetech.com
Instead of absolutely guaranteeing that a chip will reach a certain speed at a given temperature or power consumption level, simply establish that frequency range as a “maybe” and push the issue off on OEMs or enthusiasts to deal with.
In several cases, the gaps in both CPU and GPU workloads are quite significant — and favor the slower processor.
3
Nov

More Intel Core M Coming Q4

by Ian Cutress |
www.anandtech.com
All new CPUs are slated for a Q4 launch, which would mean that they might become available for end users in products on the shelf sometime in Q1 2015.
These initial CPUs should be properly available to the public in Q4 in devices such as the Lenovo Yoga 3 Pro using the Core M-5Y70.
One of the main graphs Intel was pushing in their briefing was this one, indicating what power is required for a fanless tablet.
With the 12.5-inch size and 7.3mm width, it sounds like the T300 Chi will be modifying the Core M CPU to be around 4W in order to keep the 41C skin temperature as a maximum.
The majority of the die is dedicated to the graphics core while there are two CPU cores and right below is a shared 4 MB L3 cache which is shared across the graphics and processor cores.
Since Core M is the first 14nm device, it will meet the demands of next iteration of mobility devices boasting better performance and efficiency.

Specifications Full list of technical specs

summary

Clock speed 2.2 GHz
Cores Dual core

features

Has a NX bit Yes
Has virtualization support Yes
Instruction set extensions
  1. Supplemental SSE3
  2. SSE2
  3. SSE
  4. MMX
  5. SSE3
  6. SSE4.1
  7. SSE4.2
Supports dynamic frequency scaling Yes

bus

Architecture DMI
Transfer rate 5,000 MT/s

details

Threads 4 threads
L2 cache 1 MB
L2 cache per core 0.5 MB/core
L3 cache 3 MB
L3 cache per core 1.5 MB/core
Manufacture process 32 nm

overclocking

Overclocked clock speed 2.2 GHz
Overclocked clock speed (Water) 2.2 GHz
Overclocked clock speed (Air) 2.2 GHz

power consumption

TDP 35W
Annual home energy cost 8.43 $/year
Performance per watt 3.72 pt/W
Typical power consumption 28.44W
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